Seminar Overview
Haley Fu, INEMI

INEMI Overview
Masahiro Tsuriya, INEMI

INEMI 2017 Roadmap, Board Assembly Chapter, Structure/Sample Highlights
Haley Fu, INEMI

Lenovo Data Center Group (DCG)
Joys Lee, Lenovo

Non-contact Open Test Technology VTEP
Derek Yu, Keysight Technologies

Challenges and Opportunities for Next Generation Advanced Packaging and PCB Assembly
WU WeiPing, Jabil

Advances Substrate Materials for Next Generation Package
Laminate Materials R&D Department, Hitachi Chemical Co., Ltd.

Electronic World is Changing - Technology Highlights and R&D Focus
Rainbow Yuan, AT&S