Raiyo has played a significant role in INEMI’s lead-free and low-temperature solder initiatives. He was part of INEMI’s initial Lead-Free Assembly team, which down-selected alternatives to SnPb alloys during the lead-free transition. He has also chaired the BiSn-Based Low-Temperature Soldering Process and Reliability Project since its inception in 2015, helping the team understand the technical reasons for performance differences for various alloys. Raiyo has published and presented several technical papers to share information about LTS solder alloys with industry.
Based on the LTS efforts, Raiyo identified gaps in two additional areas — electromigration and models for acceleration factors in temperature cycles — and has initiated projects to solve the technical issues in these areas.
In addition to his project leadership, Raiyo provided key technical inputs for INEMI’s Board Assembly Technology Integration Group (TIG) from 2010 to 2020 and has been a contributor to the INEMI Roadmap. He is also a participant in the Characterization of Third Generation High-Reliability Pb-Free Alloys where he provided technical input on alloy dopants to provide margins for harsh reliability requirements.