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30 Years of Innovation Conference

June 24 2026
Binghamton University
State University of New York
Binghamton, NY USA

Following are presentations from INEMI's 30-year celebration. We will also be adding recordings of the conference presentations along with photographs from the event as they become available — so be sure to check back!

 

PART I — Welcome & INEMI Retrospective

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  • Welcome & Importance of Electronics Manufacturing – Future, AI, Workforce, Technical Challenges – Anne D’Alleva, President, Binghamton University
  • Building the Electronics Manufacturing Ecosystem – Chris Rumer, Intel Corporation & INEMI Chairman
  • Setting the Stage – Shekhar Chandrashekhar, INEMI CEO
  • Charting the Journey! – Alan Rae, Consultant, ATC Materials
  • INEMI and Research – Carol Handwerker, Distinguished Professor of Materials Engineering, Professor of Sustainable Engineering, Purdue University
  • INEMI Impact and Value – Grace O’Malley, INEMI CTO

 

PART II — Opportunities & Challenges

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  • AI Infrastructure Super Cycle: Driving Forces & Supply Chain Dynamics – Jen Muncy, Vice President, IBM Supply Chain Engineering & INEMI Board of Directors & Jung Yoon, Distinguished Engineer, IBM Supply Chain
  • Advanced Packaging: Look Back and Look Forward – Ravi M.Bhatkal, Vice President, Strategy, MacDermid Alpha Electronics Solutions and INEMI Board of Directors
  • Advancing Sustainability-Driven Electronics – Cassie Gruber, CEO, Circular Bound & Founder, CALM Impact
  • AI in Smart Manufacturing: Opportunities and Risks – Avinash Vashistha, Tholons

 

PART III — Large Form Factor (LFF) Technical Session

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  • Large Form Factor: Manufacturing Needs – Shripad Gokhale, Senior Principal Engineer, Advanced Packaging Assembly, TD, Intel Corporation
  • Navigating Large Form Factor Co-Packaged Optics Assembly Challenges – Shane Nunes, Universal Instruments Corp.
  • Materials & Equipment Challenges for Large Form Factor AI Server Applications – Andy Mackie, Principal Engineer, Indium Corporation, and INEMI Board of Directors
  • Cleaning Large Form Factor AI & HPC Packages – Ravi Parthasarathy, Principal Engineer, Advanced Applications, ZESTRON, and INEMI Board of Directors
  • BGA SLI Reliability and Test – Raiyo Aspandiar, Packaging Engineer, Intel Corporation (retired) and INEMI Project Leader, LTS PR and LTS EM Projects
  • Closing & Key Takeaways – Shekhar Chandrashekhar, INEMI CEO

 

 

   

 

     

 

      

 

     

     

 

       

     

            

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