June 24 2026
Binghamton University
State University of New York
Binghamton, NY USA
Following are presentations from INEMI's 30-year celebration. We will also be adding recordings of the conference presentations along with photographs from the event as they become available — so be sure to check back!
PART I — Welcome & INEMI Retrospective
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- Welcome & Importance of Electronics Manufacturing – Future, AI, Workforce, Technical Challenges – Anne D’Alleva, President, Binghamton University
- Building the Electronics Manufacturing Ecosystem – Chris Rumer, Intel Corporation & INEMI Chairman
- Setting the Stage – Shekhar Chandrashekhar, INEMI CEO
- Charting the Journey! – Alan Rae, Consultant, ATC Materials
- INEMI and Research – Carol Handwerker, Distinguished Professor of Materials Engineering, Professor of Sustainable Engineering, Purdue University
- INEMI Impact and Value – Grace O’Malley, INEMI CTO
PART II — Opportunities & Challenges
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- AI Infrastructure Super Cycle: Driving Forces & Supply Chain Dynamics – Jen Muncy, Vice President, IBM Supply Chain Engineering & INEMI Board of Directors & Jung Yoon, Distinguished Engineer, IBM Supply Chain
- Advanced Packaging: Look Back and Look Forward – Ravi M.Bhatkal, Vice President, Strategy, MacDermid Alpha Electronics Solutions and INEMI Board of Directors
- Advancing Sustainability-Driven Electronics – Cassie Gruber, CEO, Circular Bound & Founder, CALM Impact
- AI in Smart Manufacturing: Opportunities and Risks – Avinash Vashistha, Tholons
PART III — Large Form Factor (LFF) Technical Session
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- Large Form Factor: Manufacturing Needs – Shripad Gokhale, Senior Principal Engineer, Advanced Packaging Assembly, TD, Intel Corporation
- Navigating Large Form Factor Co-Packaged Optics Assembly Challenges – Shane Nunes, Universal Instruments Corp.
- Materials & Equipment Challenges for Large Form Factor AI Server Applications – Andy Mackie, Principal Engineer, Indium Corporation, and INEMI Board of Directors
- Cleaning Large Form Factor AI & HPC Packages – Ravi Parthasarathy, Principal Engineer, Advanced Applications, ZESTRON, and INEMI Board of Directors
- BGA SLI Reliability and Test – Raiyo Aspandiar, Packaging Engineer, Intel Corporation (retired) and INEMI Project Leader, LTS PR and LTS EM Projects
- Closing & Key Takeaways – Shekhar Chandrashekhar, INEMI CEO