Overview

With devices operating at power densities exceeding 1000 W, traditional cooling methods are no longer sufficient. Dr. Jie Geng of Indium Corporation will present the latest innovations in TIM technologies—including greases, phase-change materials, liquid metal alloys, and Indium-based metal TIMs—and how they perform under thermal cycling, vibration, and humidity. The session will also highlight hybrid TIM stacks that combine multiple materials for optimal heat transfer and compliance.

Attendees will gain insights into material selection criteria, real-world performance comparisons, and emerging solutions that support safe, efficient operation of AI and HPC platforms under extreme workloads.

Featured Speaker

Dr. Jie Geng – R&D Manager, TIM Group, Indium Corporation: Where he leads the development of advanced Thermal Interface Materials (TIMs) and innovative testing methods for thermal product evaluation.

Topics to Be Covered

• TIM performance under extreme power densities
• Comparison of greases, phase-change materials, liquid metals, and Indium-based TIMs
• Hybrid TIM stack design for enhanced thermal and mechanical performance
• Reliability under thermal cycling, vibration, and humidity
• Material selection strategies for AI and HPC platforms

Registration

This webinar is open to industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile.

For additional information, please contact Masahiro Tsuriya ([email protected]).