TA3: Next Gen Applications Track 
INEMI Invited Session: 5G/6G Roadmap Creation and Packaging Challenges 
Tuesday, March 19, 2024  
Fountain Hills, Arizona USA 

Introduction/Overview: 5G/6G Roadmap Creation and Packaging Challenges 
Low Loss Dielectric Materials Characterization Roadmap 
Michael J. Hill, Intel Corporation 

The Mid-Atlantic Semiconductor Hub (MASH): A distributed network of resources and talent to reassert U.S. leadership in semiconductor manufacturing 
Daniel Lopez, Penn State University 

6G and sub-THz Materials and Test Requirement Roadmap 
Hongbin Yu, Arizona State University 

5G Electronics: Bridging the measurement challenges with reference material development 
Lucas Enright, NIST