October 13, 2023 / Shenzhen, China
Hosted by ZESTRON

Workshop Summary

The INEMI Workshop on Reliability & Standards for Automotive Electronics, hosted by ZESTRON in Shenzhen, drew 53 people from 28 companies to discuss technology trends along with needs and solutions for high-power and high-reliability EVs. Workshop speakers introduced new developments in materials and PCBs, talked about typical defects in PCBAs and connectors, and discussed application of FMEA (failure mode and effects analysis), smart testing and big data analysis to help with quality management not only in manufacturing but throughout the product life. See below for links to download presentations.

The group also reviewed development and status of standards for automotive electronics. Four break-out groups provided more in-depth discussion in the areas of: 

• Interconnect reliability
• Smart testing and big data analysis
• Battery packs
• Reliability of electrical isolation. 

Each break-out group identified major issues and concerns for their respective topics and discussed possible solutions. Based on these discussions, the workshop proposed industry collaboration to work on the following:

• Establish long-term thermal/mechanical reliability data for second-level PCBA solder joints
• Investigate gaps and needs for standardized SMT evaluation framework or guidelines 
• Identify best practices to ensure cable contact quality in battery packs (including cable selection, verification, and test)
• Investigate and define typical mission/environment profiles for different EV modules

INEMI will review these suggestions and the needs of the ecosystem to translate those needs into actionable projects. Contact Haley Fu ([email protected]) to get involved in the discussion and planning.

Presentations

Welcome & Speaker Introduction, Dr. Haley FU, INEMI
Workshop Overview, Preliminary Results from INEMI Survey on Reliability Challenges to Automotive Electronics, Dr. Haley FU, INEMI
FMEA Based Automotive Module Qualification Procedure (Chinese), Leo LU, Continental
Smart Testing for PCB Assembly and The Challenges, Fei ZHOU, NIO
Enhance Automotive Electronics Quality by Increasing Test Coverage in Functional Test along with Big Data Analytics, Teong Seng KOAY, Keysight AES Solution Planner
Reliability Challenges for High Voltage Automotive Electronics, Colin WANG, ZESTRON
Automotive Electronics Trend and Impact to PCB Design, Lio LI, AT&S  
Low-voiding High-reliability Lead-free Solder Paste for Automotive Applications, Wisdom QU, Indium 
Challenges and Solutions to Electrical Wiring Harness Connectors (Chinese), Wenqiang MAO, NIO
New Energy Vehicles and Reliability Standardization, Zhiman CHEN, CRRC ZIC

Video Overview of Workshop (Chinese)
Video Overview of Workshop (English)