Low-Temperate Solder Tech Topic Series

SMTA International; October 9-12, 2023; Minneapolis, Minnesota
“A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys,” Richard Coyle, PhD (Nokia Bell Labs), Session IRR1: Programs Addressing High Reliability and Mission Critical Applications, SMTA International, October 10, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
INEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys  
“The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects,” Dan Burkholder and Raiyo Aspandiar, Ph.D. (Intel Corporation); Session LTS1: Thermal Cycling Performance of LT Sn-Bi Solder Joints with and without Aging Low Temperature Solder, SMTA International, October 11, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
INEMI project: BiSn-Based Low-Temperature Soldering Process and Reliability
“Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints,” Prabjit Singh, Ph.D. (IBM Corporation), Session LTS3: Electromigration, Shear and Drop Shock Assessment of Low Temperature Sn-Bi Solder Joints, SMTA International, October 11, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
INEMI project: Electromigration of SnBi Solder for Second-Level Interconnect

“Electromigration In Tin-Bismuth Planar Geometry Solder Joints,” Prabjit Singh, PhD (IBM), Session FE1: Solder 1, International Conference on Electronics Packaging (ICEP), April 21, 2023; Kyushu, Japan (INEMI members only) Paper         Presentation
INEMI project: Electromigration of SnBi Solder for Second-Level Interconnect

“Dynamic Warpage Prediction of High-Density Interconnect Socket,” Philip Chang, PhD (CoreTech System Co., Ltd. / Moldex3D), INEMI Session, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25; Taipei, Taiwan (INEMI members only)
INEMI project: High Density Interconnect Socket Warpage Prediction and Characterization

Call-for-Participation: High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2 (January 4/5, 2023)     Project page