April 20-22, 2016
Sapporo, Japan

Session TA3
April 21, 2016

PSMC Roadmap for Integrated Photonics Manufacturing, Richard Otte (Promex Industries for PSMC)

Recent Trends of Package Warpage and Measurement Metrologies, Wei Keat Loh (Intel)

How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance, Masahiro Tsuriya (INEMI)

INEMI Framework for Implementing Material Alternatives Assessment, Haley Fu (INEMI)