Taipei, Taiwan | October 27, 2017

Introduction and Agenda, Haley Fu (INEMI)

Study of SiP Module Moldability, Chih Chung Hsu (CoreTech Systems)

INEMI Ultra Low Loss Laminate/PCB for High Reliability & Performance, John Lin (Lenovo)

BiSn-Based Low Temperature Soldering Process and Reliability, Haley Fu (INEMI)