Presentations from INEMI Session at IMPACT 2012
October 26, 2012
Taipei, Taiwan

Introduction and Agenda
Haley Fu, INEMI

2013 INEMI Technology Roadmap Highlights
Bill Bader, INEMI

Thermal Fatigue Results for Low and No-Ag Alloys
William Chao, Cisco

BFR-Free PCB for High-Reliability Products
Michael Roesch, HP

Counterfeit Components - Impact and Mitgation
Jeffrey Lee, IST-Integrated Service Technology Inc.

Current and Future Test Solution Strategies
Eugene Lin, Agilent Technologies