Taiwan | October 22, 2013

Overview and Agenda
Haley Fu, INEMI

INEMI Roadmap and Technical Plan on Organic PCB
Bill Bader, INEMI

Striking the Balance - Driving Increased Density and Cost Reduction in Printed Circuit Board Designs
Tim Swettlen, Intel

The Signal Integrity Study with Fiber Weave Effect
Peter Liang, Nan Ya CCL

PWB Roadmap for Smartphone
Hirotaka Taniguchi, IBIDEN

Novel DS's Low Loss Materials for High-Speed PCB
Jeongdon Kwon, Doosan

Low- and Mid-Loss Materials: Performance and Cost Drivers, 2013-2015
Mason Hu, Cisco

Low Transmission Loss Multilayer PWB Materials for High-Speed and High-Frequency Applications
Kazutoshi Danjobara, Hitachi Chemical

Materials for Next Generation HDI
Chris Katzko, TTM Techniologies Inc.