Singapore | May 26-27, 2016

This webinar is a follow-up to the INEMI Substrate & Package Technology Workshop:  Road to Integrated SiP Package Technology Innovation, hosted by IBM in Singapore (May 26-27, 2016).

Presentation (July 13, 2016)

Recording of webinar (July 13, 2016).  (This link is for INEMI members only.  If you are an INEMI member, please log into your account or create a web account to view.)

Workshop (May 26-27, 2016)

Further Information

Mashiro Tsuriya
[email protected]