May 11-14, 2022
Hokkaido, Japan

 
Session WA1: INEMI Session
May 11, 2022

WA1-1: “Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer Level Packaging,” presented by Feng Xue, IBM
Project: Panel Level Package Fine Pitch Substrate Inspection/Metrology, Phase 4
 
++ WA1-2: “Novel Method for Measuring High Temperature Hygroscopic Swelling,” presented by Ian Chin, Intel
Project: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Phase 1
 
++ WA1-3: “Voids in First-Level Interconnects and Their Impact to Solder Joint Reliability,” presented by Kor Oon Lee, Intel
Project: 1st Level Interconnect Void Characterization
 
WA1-4: “Low Temperature Interconnects in 1st Level Packaging and its Challenges,” presented by Charles Arvin, IBM
Project: Low Temperature Materials for 1st Level Interconnect Task Force
 
         ++ Received an ICEP 2022 Outstanding Technical Paper Award

 
Session TD2 Emerging Technology 3
Thursday, May 12

TD2-3: “Comparing Various Test Environments for Conformal Coating Evaluation,” presented by Prabjit Singh (IBM)   paper    presentation
Project: Conformal Coating Evaluation for Improved Environmental Protection, Phase 2