Kuwana, Mie, Japan | April 17-21, 2018

INEMI Session
April 19, 2018

SiP Module Mold Flowability Experiment Result and Simulation Study, Jeong YongHyuk (STATSChipPAC)

SiP Module Warpage Characterization and Simulation Study, Jim Hsu (CoreTech System/Moldex 3D)

INEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes — Part III: mechanical shock tests on PoP BGA assemblies, Jagadeesh Radhakrishna (Intel)
     Presentation
     Paper

HiP (Head in Pillow) Defects AXI Inspection Capability Study, Yoshihiro Akiyama (Saki Corporation)