INEMI Invited Session / Session A3: Next Gen Applications Track 5G/6G Roadmap Creation and Packaging Challenges
Chair: Urmi Ray
March 14, 2023
Fountain Hills, Arizona USA

5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO)
Urmi Ray, INEMI
 
6G Hardware System Design and Packaging Needs
Prof Markondeyaraj Pulugurtha, presenter Satheesh Bojja Venkatakrishnan, John Volakis; Florida International University 

5G/6G MAESTRO Materials: Glass Substrates for mmWave/sub-THz Applications
Presented by Shelby Nelson (for Paul Ballentine), Mosaic Microsystems 
 
5G Electronics: Bridging the Measurement Challenges    
Lucas Enright, NIST