Toyama, Japan | April 22-23, 2014

These presentations are available to workshop attendees and INEMI members only, except as noted.  If you are an INEMI member, please log into or create a web account to view.  If you attended the workshop and need access, please contact [email protected].

Workshop Program, Abstracts and Speaker Biographies (available to public)

Welcome and Workshop Introduction
Bill Bader, INEMI CEO

Current Technologies and Future Developments in Advanced Packaging
Rozalia Beica, Yole

Challenge of Packaging Technology in the Era of Cognitive Computer
Yasumitsu Orii, IBM Japan

Challenges of Organic Substrates from EMS Perspective
Weifeng Liu, Flextronics

Key Technology Challenges in Computing Package and Assembly
Kinya Ichikawa, Intel

Trends and Challenges of Electronic Packaging for Telecommunication
John Wen, Huawei

Trends of the Processor Module Packaging Structure
Masateru Koide, Fujitsu

INEMI Roadmap Highlights and Technology Gap
Bill Bottoms, 3MTS

Challenges to Consider in Organic Interposer HVM
Tim Lenihan, TechSearch

3D Package Technologies Review with Gap Analysis for Mobile Application Requirements
Toshihiko Nishio, STATS ChipPAC

Expectation of Embedded Device Technology and Key Challenging Area
Takashi Kariya, Ibiden

The Requirements of Future IC Substrate, a Maker Point of View
D.C. Hu, Unimicron

Development of Organic Multi Chip Package for High Performance Application
Shoji Watanabe, Shinko

Can We Prepare Organic Materials for 2.1D Next Generation Interposers?
Hikari Murai, Hitachi Chemical

Substrate Technology Discussions of 2.1/2.5D IC Packaging Process
Kazuaki Ano, Shinkawa

3D-IC Standardization Activity in Japan
Haruo Shimamoto, SEMI 3DIC Co-Leader

Outcomes of the Breakout Groups (available to public)
Three Breakout Groups