INEMI presentations given at 2013 International Conference on Electronic Packaging Technology (ICEPT 2013), (Dalian, China; August 11-14, 2013)

• Achieving Sustainable Electronics by 2033, presented by Robert C. Pfahl, INEMI (August 12, 2013)
• Methodology Development for Counterfeit Component Mitigation, presented by Jeffrey Lee, IST-Integrated Service Technology, Inc. (August 12, 2013)
• MEMS Roadmap and INEMI Initiatives Poster, presented by Haley Fu and Robert Pfahl, INEMI (August 2013)