Nagoya, Japan | November 17-18, 2009

New initiatives

1.  Warpage
       a.  Identification of Qualification Criteria (Substrates, Package and Board Levels)
       b.  Identification of Primary Factors of Warpage
2.  Miniaturization
       a.  Wiring Density Program
              1)  Materials
              2)  Lithography
              3)  Plating
              4)  Inspection and Test
3.  Holistic Approach to Packaging
       a.  Development of Holistic Modeling Process
       b.  Optimization of Time to Yield (Design, Materials, Packaging)
       c.  Reliability Methodology for Substrates

Detailed initiatives from this workshop (PDF file)

For Further Information

Haley Fu
Asia
+86 21 5835 3839
[email protected]