Taipei, Taiwan | October 26, 2012

Introduction and Agenda
Haley Fu, INEMI

2013 INEMI Technology Roadmap Highlights
Bill Bader, INEMI

Thermal Fatigue Results for Low and No-Ag Alloys
William Chao, Cisco

BFR-Free PCB for High-Reliability Products
Michael Roesch, HP

Counterfeit Components - Impact and Mitigation
Jeffrey Lee, IST-Integrated Service Technology Inc.

Current and Future Test Solution Strategies
Eugene Lin, Agilent Technologies