(vision, mission, etc.) and announcements of key upcoming events, publications/reports available, holiday message, etc
22 July 2026
Introduction and Agenda Haley Fu, INEMI 2013 INEMI Technology Roadmap Highlights Bill Bader, INEMI Thermal Fatigue Results for Low and No-Ag Alloys William Chao, Cisco BFR-Free PCB for High-Reliability Products Michael Roesch, HP Counterfeit Components - Impact and Mitigation Jeffrey Lee, IST-Integrated Service Technology Inc. Current and Future Test Solution Strategies Eugene Lin, Agilent Technologies