International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25-27, 2023 / Taipei, Taiwan
INEMI was a co-organizer of this event

INEMI Session at IMPACT 2023 
October 25, 2023
Taipei, Taiwan

These presentations are available to INEMI members only.

“Adhesion Testing of Fine Line Patterns in Integrated Packages,” Frank Wang, Unimicron Technology Corp.
INEMI project: RDL Adhesion Strength Measurement

“Dynamic Warpage Prediction of High-Density Interconnect Socket,” Philip Chang, PhD, CoreTech System Co., Ltd. (Moldex3D)
INEMI project: High Density Interconnect Socket Warpage Prediction and Characterization

“Modelling-Based Characterisation of Copper Foils for mmWave Applications,” Malgorzata Celuch, PhD, QWED
INEMI project: Reliability & Loss Properties of Copper Foils for 5G Applications

“Standardize Material Characterization to Enhance Future Communication and Sensing Application,” Chang-Sheng Chen, PhD, Industrial Technology Research Institute (ITRI)
INEMI projects: 5G/mmWave Materials Assessment & Characterization; mmWave Permittivity Reference Material Development