Ed Kelley
CEO, Four Peaks Innovation
Former Chief Technology Officer & Senior Vice President, Technology, Isola Group

Ed Kelley is presently CEO of Four Peaks Innovation, a consultancy firm. Prior to this he was Chief Technology Officer for Isola Group, which is a long-standing member of INEMI.

Since early 2019 Ed has been consistently involved in leading INEMI activities in the area of PCBs and laminates. As Chair of INEMI’s PCB & Laminates Technology Integration Group (TIG) he spearheaded and revitalized the group over a period of about four years, leading directly to the launch of four new projects in 2022-24 and identification of additional new initiatives to be developed. He has also chaired and/or been an active participant in numerous projects.

As part of his work with the TIG, Ed led the team that produced the PCB & Laminates Technical Plan from the 2019 Organic PCB Roadmap. Additionally, he helped lead development and review of content for the current roadmap on PCB topics and has leveraged his extensive network to help identify and invite experts to participate in INEMI Roadmap content development.  

Ed has worked closely with many members throughout the supply chain ensuring that PCB projects and activities of the TIG are beneficial and provide value to their membership. His personal efforts to identify common challenges for the supply chain and promote collaborative projects that bring value have had a very positive influence on retaining INEMI members and recruiting new members. Two key examples of his impactful service to INEMI include:

• Expanding the knowledgebase for PCB and laminates technologies by involving key industry stakeholders outside of INEMI membership in technical presentations as part of the PCB & Laminates TIG meetings in areas of copper foil for high-speed applications, glass cloth developments, laser drilling of microvias holes and plans future presentations on measurement techniques for electrical characterization of PCB base materials. 
  
• Leveraging his industry contacts to contribute to support project objectives whether they are members or non-members, such as the essential and significant supply of copper foil (and associated topology measurements) from Circuit Foil and Denkai America for the Reliability & Loss Properties of Copper Foils for 5G Applications Project.