HFR-Free High-Reliability PCB

End-of-Project Webinar

Presentation (October 4, 2012)
(This presentation is for INEMI members only.)

Statement of Work

Statement of Work (Version 7.0, August 4, 2008)

Project Objectives

This group proposes the evaluation of key electrical and mechanical properties, focusing on those attributes that are of greatest value to the supply chain.

• Build on industry knowledge and capability and Phase 2 (Test) of the INEMI BFR-Free PCB Project (formerly Halogen-Free)
• Consider unique market segment requirements
• Identify technology readiness and gaps
• Stimulate supply capability
• Determine BFR-free board-level reliability for various components

Presentations

INEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), April 2, 2008; IPC Circuits Expo, APEX and the Designers Summit 2008 (Las Vegas, Nevada)
INEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), updated version, April 15, 2008

Related INEMI Projects

HFR-Free PCB Material Evaluation Project 
HFR-Free Leadership Program   
   —  HFR-Free PCB Materials, Phase 2
   —  HFR-FREE Signal Integrity, Phase 2

For Additional Information

[email protected]

Project Leader