HFR-Free PCB Materials, Phase 2

This Project is part of the HFR-Free Leadership Program

Background

The goal of this project is to identify technology limitations involved in transitioning to HFR-free PCB materials. After identifying commercially viable materials, the team will identify key mechanical performance characteristics and determine if they are in the critical path for the halogen-free PCB material transition. The initial focus will be on delamination, via and PTH reliability, pad cratering, and solder joint reliability. This project will identify the technical risks, flag unexplored issues and make recommendations for future work. The project will also assess manufacturing capability and supply capacity.

Statement of Work

Statement of Work:  INEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

Related Projects

HFR-Free Signal Integrity

For Additional Information

[email protected]

Project Leaders

Chair: John Davignon, Intel