HFR-Free Signal Integrity, Phase 2

This Project is part of the HFR-Free Leadership Program

Background

This project will focus on ensuring there is no degradation of electrical signals in HFR-free PCB materials. Plans are to investigate the critical electrical parameters of new HFR-free materials. The team will identify candidate materials, review prior work to define key performance characteristics and test criteria, and design test vehicle(s) and test methodologies, leveraging standards where possible. The project will also assess technology readiness and identify gaps, plus assess manufacturing capability and supply capacity.

Statement of Work

Statement of Work:  INEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

Presentations

HFR-Free Material - Dk/Df Test Method Proposal, presented by Scott Hinaga (Cisco Systems, Inc. PCB Technology Group), April 30, 2009

Related Projects

HFR-Free PCB Material

For Additional Information

[email protected]

Project Leader

Chair: Stephen Hall, Intel

Co-Chair: David Senk, Cisco