Primary Factors in Component Warpage

Problem Statement

No clear understanding of the key contributors to the 1st and 2nd level assembly

Objectives

Identify key material properties (core, core/SM thickness, substrate, design (Cu trace/via), package assembly) and key contributors (die size, thickness) which impacts 1st level and 2nd level for different applications
Identify key process parameters (UF, MC, etc.), reflow profile, package pitch, PCB, environmental factors (shipping and storage; moisture effect) which impact warpage
Establish understanding to modulate the key contributors

Expected Output

A set of primary parameters (materials, design and processes) and the working window to control the warpage through supply chain
Recommendation / guidelines for shipping and storage

Statement of Work

Statement of Work - Primary Factors in Component Warpage (Version 3.0, September 21, 2010) (initial sign up ended November 8, 2010)

Related Work

Package Warpage Qualification Criteria (Phase 1)
Warpage Characteristics of Organic Packages, Phase 2
Warpage Characteristics of Organic Packages, Phase 3

For Additional Information

Haley Fu (Asia)
+86 21 5835 3839
[email protected]

Project Leader:

Chair: Peng Su, Cisco