Statement of Work & Project Statement
Statement of Work, Rev 1.0 (October 22, 2025)
Project Statement, Rev 1.0 (October 22, 2025)
Background
Effective thermal management is becoming more critical in electronic packaging as demand for high-performance computing and AI accelerators increases. A key component in thermal management is the thermal interface material (TIM), which minimizes thermal resistance between the silicon die and its cooling modules (heat spreader, heat sink, cold plate, etc).
Accurate TIM characterization is essential for reliable thermal performance in high-power AI applications where heat flux and temperature gradients are severe. Current industry practice relies on the ASTM D5470 standard which, in some instances, does not represent a real interaction of silicon die with thermal enabling solutions because it does not replicate the complex thermal environment of real silicon devices. It fails to simulate dynamic power profiles, non-uniform heating, complex interfacial thermal behaviors, and packaging-induced mechanical constraints that influence TIM performance in actual systems.
Purpose of Project
To address these limitations, Phase 1 of the Thermal Interface Material Performance Characterization Methodology Project is proposing a more realistic and representative approach based on the JEDEC JESD51-14 standard. The project team will develop a thermal test vehicle (TTV) to emulate realistic silicon chips, including spatially varying power densities and temperature gradients. In addition, embedded sensors will be used to enable high-resolution temperature mapping for accurate localized thermal characterization and improved thermal model validation.
The team will further expand the JESD51-14 recommendations by:
- Developing measurement guidelines and test vehicles for high-power package thermal characterization.
- Defining a standardized fixture/cold plate design and packaging configuration to enable a fair comparison of TIM performance across the industry.
- Enhancing thermal model validation and simulation.
Once Phase 1 is completed, the team will decide whether to move to Phase 2 to validate the measurement methodology for thermal behavior.
Who Should Get Involved
- OEMs, EMS providers
- Materials manufacturers
- Measurement equipment suppliers
- IC vendors and assembly houses
- Academic and research institution laboratories
Presentations
Presentation: Call-for-Participation Webinar (April2/3, 2026)
Steps for Joining the Project
Project sign-up deadline: May 8, 2026
Please note: iNEMI membership is required to participate in this project. Steps for joining the project follow.
For iNEMI members:
- Complete and sign the Project Statement (see link above)
- Email the completed statement to [email protected]
For non-members:
Contact
INEMI Project Manager: Masahiro Tsuriya
[email protected]