Winners By Award

Project Leadership Award

A team award that recognizes the individual team members of completed INEMI projects that deliver superior performance of electronics manufacturing practices, superior technology and business results and/or positive impacts to the electronics manufacturing value chain and its ecosystem.

• BiSn Based Low Temperature Soldering Process and Reliability Phase 1-3a
• RDL Adhesion Strength Measurement and Characterization, Phase 1
• Electromigration of SnBi Solder for Second-Level Interconnect

• Investigation of AI Enhancement to AOI for PCBA

• High Density Interconnect (HDI) Socket Warpage Prediction and Characterization

• Unified Equipment Interaction Methodology

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• mmWave Permittivity Reference Material Development Project

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• 1st Level Interconnect Void Characterization Project
• 5G/mmWave Materials Assessment and Characterization Project
• High Density Interconnect Socket Warpage Prediction and Characterization Project

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This award honors uncommon dedicated voluntary service to INEMI marked by outstanding performance, effective leadership, and committed service to the consortium.

• Tarja Rapala-Virtanen

• Jasbir Bath
• Dick Otte
• Jean-Luc Pelissier

• Mostafa Aghazadeh, Intel
• Marc Benowitz, Nokia Bell Labs and INEMI (retired)
• Ed Kelley, Four Peaks Innovation (previously with Isola Group)
• Ed Tinsley, Dell (retired)

• Marie Cole, IBM (Retired)
• Dr. Alan Rae, University at Buffalo
• Julie Silk, Keysight Technologies